Three-Dimensional Integration and Modeling

Three-Dimensional Integration and Modeling
A Revolution in RF and Wireless Packaging

Jong-Hoon Lee, Manos M. Tentzeris
ISBN: 9781598292442 | PDF ISBN: 9781598292459
Copyright © 2007 | 108 Pages | Publication Date: 01/01/2007

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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.

Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

Table of Contents

Introduction
Background on Technologies for Millimeter-Wave Passive Front-Ends
Three-Dimensional Packaging in Multilayer Organic Substrates
Microstrip-Type Integrated Passives
Cavity-Type Integrated Passives
Three-Dimensional Antenna Architectures
Fully Integrated Three-Dimensional Passive Front-Ends
References

About the Author(s)

Jong-Hoon Lee, RFMD

Manos M. Tentzeris, Georgia Institute of Technology

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